The FINANCIAL — In response to incredible customer demand, Intel has doubled its combined 14nm and 10nm manufacturing capacity over the past few years. To do this, the company found innovative ways to deliver more output within existing capacity through yield improvement projects and significant investments in capacity expansion.
“Over the last three years, we have doubled our wafer volume capacity, and that was a significant investment. Moving forward, we’re not stopping… We are continuing to invest into factory capacity to ensure we can keep up with the growing needs of our customers,” says Keyvan Esfarjani, senior vice president and general manager of Manufacturing and Operations at Intel.
The company also ramped its new 10nm process this year. Intel currently manufactures 10nm products in high volumes at its Oregon and Arizona sites in the U.S. and its site in Israel.
In 2020, Intel introduced an expanding lineup of 10nm products including 11th Gen Intel® CoreTM processors and the Intel Atom® P5900, a system-on-chip for wireless base stations. In addition, the company introduced 10nm SuperFin technology, which enables the largest single intranode enhancement in Intel’s history and delivers performance improvements comparable to a full-node transition.
Esfarjani explains: “10nm progress is coming along quite well. We have three high-volume manufacturing operations that are going full steam ahead to see how we can do more, better and faster, and continue to support our customers.”